| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| SM0103B-U381-H01 | IC |
AAC |
SMD |
22+ |
2000 |
|||
| S140B381-067 | IC |
GOERTEK/歌尔 |
SMD |
22+ |
300 |
|||
| 505070-0642 | 连接器 |
MOLEX/莫仕 |
SMD |
22+ |
650 |
|||
| NL3S325FCT2G | IC |
ONSEMI/安森美 |
WLCSP-9 |
18+ |
3000 |
|||
| BGA824N6E6327 | IC |
INFINEON/英飞凌 |
TSNP6 |
17+ |
9400 |
|||
| MIC94300YMT | 其他被动元件 |
MICROCHIP/微芯 |
QFN |
16+ |
1725 |
|||
| SPK0838HT4H-1-7 |
|
IC |
KNOWLES/楼氏 |
SMD |
21+ |
2990 |
||
| XC2S50-5TQG144I | IC |
XILINX/赛灵思 |
QFP144 |
10+ |
7 |
|||
| SPH18P4HM4H-1-8 | IC |
KNOWLES/楼氏 |
SMD |
22+ |
1000 |
|||
| LP5907SNX-2.8 |
|
IC |
TI/德州仪器 |
X2SON-4 |
20+ |
12000 |
||
| MCP6561T-E/OT | IC |
MICROCHIP/微芯 |
SOT23-5 |
20+ |
2535 |
|||
| SPV6842LR5H-1 | IC |
KNOWLES/楼氏 |
SMD |
21+ |
500 |
|||
| MA-FRA381-A13-4 | IC |
GETTOP |
SMD |
22+ |
5000 |
|||
| LPS28DFWTR | IC |
ST/意法 |
SMD |
21+ |
300 |
|||
| GD32E230F6V6 | IC |
GD/兆易创新 |
LGA20 |
20+ |
100 |
|||
| WIL6000 | IC |
东电电子 |
BGA |
21+ |
140 |
|||
| P25Q40L-UVH-IR | IC |
PUYA/普冉 |
USON8 |
20+ |
140 |
|||
| BU27030NUC-E2 |
|
IC |
ROHM/罗姆 |
SMD |
19+ |
480 |
||
| MCIMX6Q6AVT10AD | 其他IC |
NXP/恩智浦 |
BGA |
19+ |
5000 |
|||
| PMF511816DBR-KADN | PMTECH |
FBGA |
16+ |
56 |
||||
| LE25S161PCTXG | 存储IC |
ONSEMI/安森美 |
UDFN-8 |
16+ |
380 |
|||
| MT41J128M16JT-107G:K | 存储IC |
MICRON/美光 |
BGA |
16+ |
13 |
|||
| EDFA164A2PF-JD-F-D | 内存芯片 |
MICRON/美光 |
BGA |
15+ |
35 |
|||
| BAM04-I24B-C08 | SMD |
18+ |
4563 |
|||||
| S1D13775B02B60L | 其他被动元件 |
EPSON/爱普生 |
BGA |
15+ |
1560 |
|||
| DF40C-40DP-0.4V | 手机连接器 |
HIROSE/广濑 |
SMD |
18+ |
2300 |
|||
| BM23FR0.6-20DS-0.35V | 手机连接器 |
HIROSE/广濑 |
SMD |
18+ |
4530 |
|||
| P9 | N/A |
SOD-323 |
16+ |
465 |
||||
| AXT460124 |
|
手机连接器 |
PANASONIC/松下 |
SMD |
16+ |
285 |
||
| DF12E(4.0)-30DP-0.5V(81) | 手机连接器 |
HIROSE/广濑 |
Connecror |
16+ |
580 |